Factory Supplier Ultrasonic Automatic Wire Bonding Machine For LED Lab Wire Bonding Machine

Factory Supplier Ultrasonic Automatic Wire Bonding Machine For LED Lab Wire Bonding Machine
  • Factory Supplier Ultrasonic Automatic Wire Bonding Machine For LED Lab Wire Bonding Machine

    • Factory Supplier Ultrasonic Automatic Wire Bonding Machine For LED Lab Wire Bonding Machine

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    machine typeWelding Manipulatorvoltage220V
    current1ATypeManual
    conditionNewMaterialMetal, Aluminum
    rated capacity300Wmax.input power300W
    dimensions600mm*560mm*390mmrated duty cycle180W
    usagewire bonderweight (kg)40
    Product nameUltrasonic Wire Bonding Machinealuminum wire diameter0.7mil-3.0mil/ 18um~75um
    Welding angle45 degreesWelding wire span0-10mm
    Welding arc0-6mmWelding time5-200ms±5% (20ms/division)
    frequency adjustment method61KHz±1KHz, automatic trackingWelding pressure10-60g
    CertificationCEApplicationWelding of internal leads in semiconductor devices
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