Professional Manufacturer of Plastic Processing Machinery
Heavy Aluminum Wire Wedge Bonder Ultrasonic Wedge Bonding Equipment for Semiconductor Power Devices
Heavy Aluminum Wire Wedge Bonder Ultrasonic Wedge Bonding Equipment for Semiconductor Power Devices
| Machine Type | Wedge Bonder | Voltage | 220 V |
| video outgoing-inspection | Provided | Weight (KG) | 50 |
| Product Name | Wedge Bonder | Item | HY-HW3200 |
| Bondable Aluminum Wire Diameter | 250~500μm (10~20mil) | Bondable Aluminum Ribbon Width | 1mm, 1.5mm, 2mm (40mil, 60mil, 80mil) |
| Ultrasonic Power | 0~24W | Bonding Time | 10~500ms |
| Bonding Force | 250~3000g | Max. Automatic Span from 1st to 2nd Bond | 0~18mm |
| Microscope | 15x, 30x | Illumination Lamp | Brightness adjustable |
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