HY WB2000 Ultrasonic Aluminum Wire Bonder Wire Bonding Machine Chips and Substrate

HY WB2000 Ultrasonic Aluminum Wire Bonder Wire Bonding Machine Chips and Substrate
  • HY WB2000 Ultrasonic Aluminum Wire Bonder Wire Bonding Machine Chips and Substrate

    • HY WB2000 Ultrasonic Aluminum Wire Bonder Wire Bonding Machine Chips and Substrate

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    Machine TypeUltrasonic Aluminum Wire BonderVoltage220 V
    core componentsEnginemachinery test reportProvided
    video outgoing-inspectionProvidedWeight (KG)36
    Product nameUltrasonic Aluminum Wire BonderAluminum wire diameter0.7mil-3.0mil / 18μm-75μm
    Corresponding capillaryouter diameter 1.6mm, length 21mmWire span0-10mm (stepper motor, digitally controlled)
    Ultrasonic power0-5W (continuously adjustable)Bonding time5-200ms ±5% (20ms per step)
    Ultrasonic frequency61kHz ±1kHz, automatic frequency trackingBonding force range10-60g (2 channels, electromagnetic control)
    Dimensions600mm 560mm 390mm (LWH)Microscope MagnificationDual magnification 15 and 30 (standard configuration)
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